Potato Wafer Machine


Potato Wafer Machine – High-Speed Slicing for Perfectly Crisp Wafers Every Time

The Potato Wafer Machine is engineered to deliver precision slicing for making uniform, crispy potato wafers with ease. Ideal for commercial kitchens, snack manufacturers, and food processing units.

This machine speeds up production while ensuring consistent thickness and quality. Its high-capacity design allows for bulk processing, making it suitable for high-demand settings. With durable construction and easy-to-operate features.

The Potato Wafer Machine is built for reliable, efficient performance, reducing preparation time and enhancing product consistency.

ADVANTAGES :

  • Uniform slicing for consistent wafer quality
  • High-capacity for bulk production
  • Speeds up wafer preparation
  • Durable for continuous commercial use
  • User-friendly operation for convenience
  • Easy to clean and maintain

Product Specification

  • Body: Stainless Steel (S.S)
  • RPM Speed: 960
  • Blead Dimension: 4.5 inch
  • Dies Available: 3 (Lachha, Line, Plain)

Model Details:

  • Size (LxBxH): 19x13x26 inch
  • Weight: 43 kg
  • Motor: 0.5 HP
  • Die Dimension: 6.3x4.9 inch
  • Capacity: 250 kg/hr
  • Motor RPM: 1440

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